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MEGA HIRING FOR HARDWARE AND EMBEDDED SYSTEM ENGINEER BY QUALCOMM & TESSOLVE

 

QUALCOMM : 2024 CAMPUS HIRE ENGINEER – HW

Eligibility:

  • Qualification: Masters, Bachelors: Electrical Engineering , VLSI , Embedded and VLSI , ECE
  • 2022/2023/2024 batches are eligible.
  • Verifying SoC with embedded RISC/DSP processors, communications/ networking ASICs.
  • Verilog or VHDL, C/C++, Tcl/Perl/shell-scripting. RTL design experience and/or strong OO programming knowledge
  • Knowledge of wireless/wired communications and protocols or graphics/video multi-media is a plus.
  • Knowledge in PLL, LNA, OpAmp, CMOS, ADC/DAC, Cadence, SpectreRF, or Layout is required in RF/Analog/Mixed Signal IC Design.
  • Excellent analytical and problem solving skills.
  • Ability to collaborate and work in teams.
  • Good verbal and written communication skill


Apply through the link here: CLICK HERE  (Apply Before the Link Expires)




TESSOLVE : EMBEDDED TRAINEE SOFTWARE ENGINEER

Eligibility:

  • Qualification: ME/Mtech – Embedded Systems
  • Excellent Communication Skills.
  • Ready to learn New Technology in embedded system such as protocol development & validation
  • Good in C, C++ & Embedded Systems
  • Good knowledge on Processor (ARM, Cortex) & Embedded systems
  • Knowledge on Linux Internals
  • Knowledge Protocols such as I2C, SPI, UART
  • Knowledge on basic Python.

Apply through the link here: CLICK HERE  (Apply Before the Link Expires)

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